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6396BGE

Part number 6396BGE
Product classification Heat Sinks
Manufacturer Nuventix (BOYD)
Description FG-HTSK-AL-16793-25.4-B-PINS-ROH
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Price

Total price

527

$1.3230

$697.2210

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Product parameters
TYPEDESCRIPTION
MfrNuventix (BOYD)
Series-
PackageBulk
Product StatusACTIVE
MaterialAluminum
Length1.000" (25.40mm)
ShapeRectangular, Fins
TypeBoard Level, Vertical
Width1.650" (41.91mm)
Package CooledTO-220, TO-218
Attachment MethodBolt On and PC Pin
Power Dissipation @ Temperature Rise4.0W @ 30°C
Thermal Resistance @ Forced Air Flow1.50°C/W @ 600 LFM
Thermal Resistance @ Natural5.60°C/W
Fin Height1.000" (25.40mm)
Material FinishBlack Anodized

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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