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FMAMC5013

Part number FMAMC5013
Product classification Heat Sinks
Manufacturer Fairview Microwave
Description AMPLIFIER HEAT SINK FOR MOST RF
Encapsulation
Packing Bag
Quantity 0
RoHS status NO
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$635.1870

$635.1870

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TYPEDESCRIPTION
MfrFairview Microwave
Series-
PackageBag
Product StatusACTIVE
Length8.000" (203.20mm)
ShapeRectangular, Fins
TypeTop Mount
Width5.710" (145.03mm)
Package CooledPower Modules
Attachment MethodAdhesive
Fin Height1.790" (45.47mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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