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HC9P5502B-9

Part number HC9P5502B-9
Product classification Telecom
Manufacturer Harris Corporation
Description EIA/ITU PABX SLIC
Encapsulation
Packing Bulk
Quantity 29750
RoHS status NO
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Total price

87

$3.6435

$316.9845

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Product parameters
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TYPEDESCRIPTION
MfrHarris Corporation
Series-
PackageBulk
Product StatusOBSOLETE
Package / Case24-SOIC (0.295", 7.50mm Width)
Mounting TypeSurface Mount
FunctionSubscriber Line Interface Concept (SLIC)
Interface2-Wire, 4-Wire
Operating Temperature-40°C ~ 85°C
Voltage - Supply-42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V
Supplier Device Package24-SOIC
Number of Circuits1
Power (Watts)690 mW

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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