13691652059
取消

THGJFJT0E25BAIP

Part number THGJFJT0E25BAIP
Product classification Memory
Manufacturer Toshiba Memory America, Inc. (Kioxia America, Inc.)
Description 128GB UFS V4.0
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$48.6885

$48.6885

10

$45.4230

$454.2300

25

$43.5225

$1,088.0625

152

$39.4380

$5,994.5760

Obtain quotation information
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrToshiba Memory America, Inc. (Kioxia America, Inc.)
Series-
PackageTray
Product StatusACTIVE
Package / Case153-WFBGA
Mounting TypeSurface Mount
Memory Size1Tbit
Memory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C
Voltage - Supply2.4V ~ 2.7V
TechnologyFLASH - NAND
Clock Frequency2.32 GHz
Memory FormatFLASH
Supplier Device Package153-WFBGA (11.5x13)
Memory InterfaceUFS 4.0
Memory Organization128G x 8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
关闭
Inquiry
captcha

13691652059

点击这里给我发消息
0