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XCVC1502-2LSENSVG1369

Part number XCVC1502-2LSENSVG1369
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSAL AI-CORE FPGA 1369BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$21,842.6250

$21,842.6250

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Product parameters
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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed450MHz, 1.08GHz
Number of I/O500
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 800k Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 2POS
Sullins Connector Solutions
CONN HEADER R/A 2POS
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