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FMAMC5013

零件编号 FMAMC5013
产品分类 散热片
制造商 Fairview Microwave
描述 AMPLIFIER HEAT SINK FOR MOST RF
封装
包装
数量 0
RoHS 状态 NO
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总数

数量

价格

总价

1

$635.1870

$635.1870

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产品参数
PDF(1)
类型描述
制造商Fairview Microwave
系列-
包装
产品状态ACTIVE
长度8.000" (203.20mm)
形状Rectangular, Fins
类型Top Mount
宽度5.710" (145.03mm)
封装冷却Power Modules
安装方法Adhesive
翅片高度1.790" (45.47mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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