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ET120525MMX33MMC9

零件编号 ET120525MMX33MMC9
产品分类 RFI 和 EMI - 屏蔽和吸收材料
制造商 3M
描述 3M TIN-PLATED COPPER FOIL EMI SH
封装
包装 散装
数量 0
RoHS 状态 NO
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库存:
总数

数量

价格

总价

12

$72.3975

$868.7700

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产品参数
类型描述
制造商3M
系列-
包装散装
产品状态ACTIVE

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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